Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating.

Application details

WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to apply a thin coating of WACKER® PASTE P 12. In the assembly of semiconductors, e. g. diodes, transistors and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. When assembled, a firm metal-to-metal contact might be hampered by these surface irregularities. A significant percentage of the device's surface therefore might lack direct contact to the heatsink. Remaining gaps are filled with air, providing relatively poor thermal conductivity.

By coating the contact surfaces with WACKER® PASTE P 12, surface irregularities will be filled with the heat sink silicone paste. The thermal conductivity of WACKER® PASTE P 12 is about 20 times better than that of air. Practical experience has shown that by using WACKER® PASTE P 12, the heat transfer resistance from the semiconductor housing to the cooling elements is reduced by 50 %.