Convective Rework System
The ST 325 is a digital, self-contained and fully programmable system for the manual installation and removal of SMD’s. Programming features allow the development of thermal profiles using up to 4 zones which include: pre-heat, soak, reflow and cool down. Each programmed zone allows for unique parameters to be set for times, temperatures and air flow rates. The handpiece features an integrated, spring loaded vacuum pick with interchangeable vacuum cup sizes for holding and lifting components.
From the front panel, the system can be used in either manual or "timed" modes. Manual mode means that the system generates heated airflow when the cycle button is pressed; when it is pressed a second time the system shuts off. "Timed" modes allow the operator to create up to 20 "Profiles" that consist of time and temperatures parameters to ensure process control and repeatability. Both cycle start and vacuum functions are activated with conveniently located switches on the handpiece.
The ST 325 comes standard with one K-type thermo-couple input that can be used to monitor the thermal environment at the work site with optional software. The system also comes with the Lo-Flo pump and the vacuum wand (PV-65) for manipulating components manually.
When additional programming capability is required, such as 4 zone profile creation, an optional software package is available that can be used with a PC or laptop (1199-0019-P1). The optional software package further allows the ST 325 to control the ST 450 Preheater when bottom side heating of the PCB is required. Once the 4 zone profiles have been created with the software, they can be downloaded to the ST 325 and can be run WITHOUT the PC or laptop being connected!
The system can install standard BGA packages when fitted with the ST 500, ST 525 or ST 550, ST 450 or ST 400, and the optional PC or laptop software. Course pitch area array components are aligned using a proven, reliable template method that is easy to use.
Patented, Adjustable, Spring Loaded Vacuum Pik
The handpiece is fitted with an adjustable, spring loaded vacuum pik to lift components from the PCB and to hold the component in the nozzle during alignment.
The "give" in the spring loading is set, but the absolute position of the vacuum pik is adjustable over a 1.5" length.