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MG Chemicals 832TC-300L - Thermally Cond Epoxy Potting and Encapsulating Compound

0 reviews | Model: MG Chemicals 832TC-300L


  • Thermal conductivity of 0.68 W/(m.K)
  • Low exotherm
  • Convenient 1A:1B volume mix ratio
  • High compressive and tensile strength
  • Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
  • Excellent electrical insulating characteristics
  • Extreme resistance to water and humidity (allows for submersion where needed)
  • Solvent-free
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