• One component - requires no mixing
• Red high viscosity gel
• Positive under UV light
• Syringe dispense method
• Medium 15,000 -25,000 dots/h dispense spped.

One-part, electrically non-conductive adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering.

If your surface mount adhesive tick list includes medium to high dispense speeds, high dot profile and high wet strength, try LOCTITE 348. This heat cure adhesive requires no mixing, and is perfect for bonding surface mounted devices to printed circuit boards prior to wave soldering.

Specifications:

Cure type: Heat cure

Number of components: 1 part

Physical form: Gel

Shear strength, Steel (grit blasted): 1450.0 psi

Storage temperature: 2.0 - 8.0 °C

Viscosity, cone & plate Haake PK100, M10/PK1, 2°: 1.0 - 5.0 Pa∙s