ECCOBOND E 1172 A, Underfill Epoxy, 30cc Syringe
One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.
When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
Specifications:
Cure schedule, @ 135.0 °C: 6.0 min.
Glass transition temperature (Tg): 135.0 °C
Viscosity, Brookfield, Spindle 3, speed 5 rpm: 17000.0 mPa·s (cP)