LA 3032-78 Epoxy Adhesive, 10cc Syringe
The LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics.
Specifications:
Casson viscosity, Cone diameter 2 cm, Angle 2° Shear Rate 50 s⁻¹: 500000.0 mPa·s (cP)
Cure schedule, @ 100.0 °C: 15.0 min.
Cure schedule, @ 120.0 °C: 3.0 min.
Glass transition temperature (Tg): 110.0 °C
Storage modulus, @ 25.0 °C Ramp Rate 3 °C/min., 1 Hz, 10μm: 3700.0 N/mm² (536639.0 psi )
Thixotropic index: 6.5