ABLESTIK 8-2, Epoxy Adhesive, Bipax 2.5 Grams
The LOCTITE ABLESTIK 8-2 non-conductive die-attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
Specifications:
Applications: Die Attach
Cure schedule, @ 95.0 °C: 1.5 hr.
Number of components: 1 Part
Shear strength, Aluminum: 2300.0 psi
Storage temperature: -40.0 - 25.0 °C