• High Reliability
• Reliable residues in harsh modified SIR testing
• Consistent print performance down to 0.55 area ratio in all print conditions
• Excellent solderability and wetting across varied profiles - Similar performance in air vs. N2 - Resistance to tombstoning
• Low voiding across a wide variety of profiles
• Compatible with multiple conformal coatings
• Extremely stable paste properties - No loss in print performance after 30°C/70%RH for 7 days
• Passed the Bono Corrosion Test with a corrosion factor (Fc) value of 1.1%

Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high-reliability applications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping behavior. Post-soldering, the NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-004B. NP505-HR is part of Kester’s high-reliability product line and is compatible with no-clean RF550 Rework Flux, NF372-TB Solder Flux, and SELECT-10 Selective Soldering Flux.

NP505-HR is available in the SAC305 alloy with Type 3, 4 & 5 powder mesh, and Innolot high-reliability alloy in Type 4. Type 4 mesh size is recommended for standard and fine-pitch applications. NP505-HR is also compatible with other SAC alloys in a similar melting range to the listed alloys. For specific packaging, information refers to this product’s Product Offerings tab at kester.com for available sizes. The appropriate combination depends on process variables and the specific application.