2331-ZX Flux-Pen, Water-Soluble
Kester 2331-ZX Flux-Pen is designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. 2331-ZX Flux-Pen is an innovation in organic acid water soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water soluble flux available to the electronics industry.
This popular flux has been used for soldering critical assemblies in the telecommunications, computer and other industries. No offensive odors will be emitted during soldering. 2331-ZX Flux-Pen will not create excessive foaming in standard water cleaning systems. 2331-ZX Flux-Pen has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. 2331-ZX Flux-Pen is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the stated banned substances.
Flux Application
2331-ZX Flux-Pen is applied to circuit boards via Flux-Pen for rework of printed wire assemblies.
Process Considerations
2331-ZX Flux-Pen should only be applied to areas that will be fully heated by the soldering iron or other reflow tool. Care should be taken to avoid flooding the assembly. The surface tension has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation.
Cleaning
Flux residues after soldering must be removed as they are conductive and corrosive. No neutralizer, saponifiers or detergents are necessary in the water wash system for complete removal of flux residues. It is not recommended to use high mineral content tap water.
Otherwise, tap, deionized or softened water may be used for cleaning. The optimum water temperature is 54 to 66 °C (130 to 150 °F), although lower temperatures may be sufficient.