R560 Solder Paste, Sn63Pb37, Water-Soluble, Leaded, 500g Jar
Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder connections. The voiding in BGA's has been shown to be reduced from 25% to less than 5%. R560 is also resistant to extremes in temperature and relative humidity. R560 is designed to be slump resistant in high humidity conditions. The solder paste exhibits long stencil life and tack time while still delivering exceptional solderability to a wide variety of metallic substrates. The activator package in this formula is very aggressive, providing superior wetting to OSP coated boards and Ag/Pd leaded components.
Performance Characteristics:
- Reduces BGA voiding to under 5%
- 8 hour stencil life
- Consistent printing over a range of temperatures and humidity levels
- Wets excellently to Ag/Pd leaded components
- Reduces scrap due to less paste dry out
- Residues easily removed with hot DI water
- Classified as ORHO per J-STD-004
- Compatible with enclosed printing systems
Standard Applications:
- 90% Metal - Stencil Printing
- 90% Metal - Enclosed Head Printing
Availability
R560 is commonly available in the Sn63Pb37 and Sn62Pb36ag02 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. The appropriate combination depends on process variables and the specific application.
Cleaning
R560 residues are best removed using automated cleaning equipment (in-line or batch) within 24 hours of soldering. Deionized water is recommended for the final rinse. Water temperatures should be 49 to 60 °C (120 to 140 °F). Kester’s 5768 Bio-Kleen saponifier can also be used in a 1 to 2% ratio for aqueous cleaning systems.