EP256 Solder Paste, Sn63Pb37, No-Clean, Leaded, 500g Jar
EP256 is a no-clean, air or nitrogen-reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. The EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. It is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
Performance Characteristics:
- Stable wetting behavior over a wide range of profiles
- Capable90-minutenute break times in printing
- High print speeds to 200+ mm/sec (8+ in/sec)
- Compatible with enclosed print head systems
- Excellent printing characteristics to 0milsmm (16 mil) pitch with Type 3 powder
- High activity on all substrates, including OSPs
- Capable of off-pad printing with no solder balls after reflow
- Stencil life: 8+ hours (process dependent)
- Scrap is reduced drying to less paste dry out
- Stable tack over 8+ hours
- Classified as ROL1 per J-STD-004B
- Standard Applications:
- Stencil Printing: 90% Metal
- Enclosed Head Printing: 90% Metal
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.
Availability
EP256 is commonly available in the Sn63Pb37, Sn62Pb36Ag2, and Sn43Pb43Bi14 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine-pitch applications. The appropriate combination depends on process variables and the specific application.