EP256 Solder Paste, Sn62Pb36Ag2, No-Clean, Leaded, 600g Cartridge
EP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. The EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. It is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
Performance Characteristics:
Stable wetting behavior over a wide range of profiles
Capable of 90 minute break times in printing
High print speeds to 200+ mm/sec (8+ in/sec)
Compatible with enclosed print head systems
Excellent printing characteristics to 0.4 mm (16 mil) pitch with Type 3 powder
High activity on all substrates, including OSPs
Capable of off-pad printing with no solder balls after reflow
Stencil life: 8+ hours (process dependent)
Scrap is reduced due to less paste dry out
Stable tack over 8+ hours
Classified as ROL1 per J-STD-004B
Standard Applications:
Stencil Printing: 90% Metal
Enclosed Head Printing: 90% Metal
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.
Availability
EP256 is commonly available in the Sn63Pb37, Sn62Pb36Ag2 and Sn43Pb43Bi14 alloys. Type 3 powder mesh is recommended, but different powder particle size distributions are available for standard and fine pitch applications. The appropriate combination depends on process variables and the specific application.