TSF-6592LV Lead-free No-clean Tacky Flux, 30 Grams Syringe
Kester 300303 TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip-chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high-speed printing applications.