Kester’s NP575-KAP is a next-generation, high-performance, zero-halogen, lead-free, no-clean solder paste. It has been specifically developed to be a high first-pass-yield, broad latitude, high reliability, material suited for multiple applications including automotive and aerospace. This material “prints like a brick” providing a wide print window capable down to area ratios >0.60, repeatable transfer efficiencies on fine feature apertures down to 01005 components, with excellent coalescence down to 170 µm circle and square apertures. Along with the ability to achieve CpK values >2.0 with transfer efficiencies between 60% - 120% at area ratios. Additionally, this material provides outstanding electro-chemical performance, even under very harsh environmental conditions along with being pin-testable, and is IPC J-STD-004B as ROL0. NP575-KAP is Kester’s leading no-clean paste and part of our high-performance portfolio of products.