• Ultra-low flux spattering (ideal for applications with Au finger connectors)
• Ultra-low solder beading
• Halogen-free
• Superior stencil life
• Outstanding print characteristics

Indium 5.8LS is a halide-free, no-clean solder paste specifically formulated for low flux spatter. This material is designed to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other Pb-free alloy systems in an air or nitrogen reflow atmosphere. This product formulation offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high speed as well as high mix surface mount lines.