NC-SMQ230 Pb-Free Solder Paste - Sn95.5/Ag3.8/Cu0.7, T3 (89 Percent), 500g
NC-SMQ230 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAgBi, SnAg, and other Pb-free alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. NC-SMQ230 offers consistent, repeatable printing performance combined with long stencil and tack times to handle the rigors of today’s high-speed, as well as high-mix, surface mount lines.
NC-SMQ230 is a SAC solder paste with consistently repeatable printing performance combined with a long stencil and tack times.
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. The metal load required is application dependent and will vary with alloy density and mesh size. Type 3 (-325/+500 mesh) powder is standard, but other powder sizes are available. See Standard Product Specifications below for details on metal load and particle size.
Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste. The shelf life of NC-SMQ230 is 6 months when stored at <10°C. The shelf life at room temperature (3 days). Solder paste packaged in syringes and cartridges should be stored tip down.
Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.
Compatible Products
- Cored Wire: Core 230
- Wave Fluxes: WF-9940 and WF-7745
- Flux Pen: FP-500
- Rework Flux: TACFlux 023
Printing
Stencil Design:
Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:
- Discrete components - A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
- Fine-pitch components - A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
- For adequate release of solder paste from stencil apertures, a minimum aspect ratio of 1:5 is required. The aspect ratio is defined as the width of the aperture divided by the thickness of the stencil.
Cleaning
NC-SMQ230 is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.