• Compatibility with common conformal coatings
• Clear, benign residue
• Superior stencil life
• Exceptional wetting in air reflow
• Outstanding print characteristics

NC-SMQ92H is a halogen-free, air reflow, no-clean solder paste formulated for low flux spatter. It provides consistent fine-pitch paste deposition, and excellent stencil life and tack time. NC-SMQ92H has a hard flux residue and can accommodate reflow temperatures higher than typically required for many Pb-containing alloys. NC-SMQ92H meets or surpasses all ANSI/J-STD-004, -005 specifications, and Bellcore test criteria.