Solder Paste, Rosin, Leaded, T3, 90.5%, Sn63Pb37, 500g Jar
RMA-SMQ51AC is an air reflow, RMA solder paste designed for use in a wide range of environmental conditions. It has exceptional stencil life and tack strength and offers consistent print definition even in ultrafine-pitch applications. RMA-SMQ51AC’s wide processing window allows it to be used with standard eutectic SnPb, SnPbAg, and high-temperature alloys, including AuSn, SnSb, and SnAg.