• Meets leading OEM standards for non-wet open resistance
• Oxidation barrier technology delivers strong resistance to:
• Head-in-pillow defects
• Graping (non-coalescence of powder particles)
• Strong surface oxide cleaning and pad wetting during reflow ramp
• Low voiding on BGSs, CSPs, and QFNs
• Outstanding printing performance with high transfer efficiency and low variability
• Excellent response-to-pause

Indium10.8HF works best in applications that require:

Warpage induced defect elimination; such as non-wet open and HIP. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.

Compatible Products

• Rework Flux: TACFlux 020B, TACFlux 089HF
• Cored Wire: CW-807
• Wave Flux: WF-9945, WF-9958

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in syringes and cartridges should be stored tip down.

Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.

Packaging

Indium10.8HF is currently available in 500g jars or 600g cartridges. Packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request.

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

• Discrete components - A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
• Fine-pitch components - A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
• For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.

Cleaning

Indium10.8HF is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover

Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available non-water-based stencil cleaners work well.