Indium 8.9 Pb-Free Solder Paste; SAC305, T3 (88.5 Percent); 600g Cartridge
Lead-Free Solder Paste Features & Benefits
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®.
Indium 8.9
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high temperature and long reflow processes provides exceptional head-in-pillow performance.
Alloys
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powder are standard offerings with SAC alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed below.
Compatible Products
- Rework Flux: TACFlux® 089, TACFlux® 020B
- Cored Wire: CW-807
- Wave Flux: WF-7742, WF-9942
Printing
Stencil Design:
Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:
- Discrete components—A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction
- Fine-pitch components—A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
- For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.
Cleaning
Indium8.9 is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.
Stencil Cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available non-water-based stencil cleaners work well.