TACFlux 18 No-Clean Flux for Ball Attachment (25g in a 30cc Syringe)
TACFlux
Indium Corporation manufactures a complete line of TACFlux which includes no-clean, water-wash, and RMA-based fluxes. Its many uses include: rework and repair of various electronics assemblies and components, SMT component attach (including BGAs and flip-chips), BGA ball-attach, preform soldering, and virtually any application where the flux is required. Cycle times are not critical as TACFlux may sit for hours with no-reflow degradation.
Typical Properties (J-STD-004A (IPC-TM-650)
| Flux | TACFlux 007 | TACFlux 018 | TACFlux 023 |
| Flux Type Classification | ROL1 | ROL0 | ROL1 |
| Compatible Alloys | All SnPb, high-Pb, AuSn | All SnPb, most SAC alloys | SnPb and all Pb-free alloys |
| Typical Viscosity | 325kcps | 282kcps | 400kcps |
| Typical Acid Number | 85 | 128 | 100 |
| Typical Tack Strength | 355g | 149g | 225g |
| Reflow Atmosphere | Air or nitrogen | Air or nitrogen | Air or nitrogen |
| SIR | Pass | Pass | Pass |
| Electromigration (Bellcore Test) | Pass | Pass | Pass |
| Cleaning | Not needed | Not needed | Not needed |
| Typical Reflow Residual Weight | 47% | 36% | 42% |
Application
TACFlux 007, 018 and 023 can be printed or used in pin transfer applications.
Cleaning
TACFlux 007, 018 and 023 are designed for no-clean applications. If necessary, the flux residue can be removed by using a semi-aqueous system, saponified water, alcohols, or other CFC-free alternatives.
Storage and Handling
The shelf life of TACFlux® 007, 018 and 023 is 12 months when stored at 0–30°C. Flux should be allowed to reach ambient working temperature prior to use. Packaging should be labeled with the date and time of opening.