Indium6.4R is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.

Indium6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding.