• Alloy: SAC305
• Type 4 powder (88 percent metal load)
• Quantity: 500g jar 
• Superior printing for miniaturization
• Eliminates clogged apertures through advanced rheology

Indium8.9HFA Solder Paste Delivers Superior Printing for Miniaturization

Indium8.9HFA is a versatile, halogen-free, Pb-free solder paste with leading print performance on miniaturized components.

Print performance is especially critical for manufacturers of mobile phones and other personal electronic devices, especially as they struggle with <8mil challenges associated with continuing miniaturization in the electronics assembly industry.

Indium8.9HFA Solder Paste provides:

• Low Cost of Ownership & High Print Yields
• Unsurpassed transfer efficiency for consistent, full-volume print deposits (8 mils), results in reduced frequency of insufficient and high first-pass print yields
• Low print pressure and excellent response-to-pause save time and money on stencils and line changes
• Solvent-free dry-wiping reduces costs
• Increased throughput
• Higher print speed and reduced wipe frequency enable short cycle time, high up-time, and high throughput printing

Indium8.9HFA works best in applications that require:

• Fine feature printing presents challenges for yields (area ratios <0.66); this includes most personal electronics applications
• High-speed printing applications (>100mm/second or >4 inches/second)

Avoid the Void

Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.

Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.

Indium 8.9HFA

Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Complementary Products

• Rework Flux: TACFlux 089HF, TACFlux 020B-RC
• Cored Wire: CW-807, Core 230-RC
• Wave Flux: WF-9945, WF-9958

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. Solder paste packaged in cartridges should be stored tip down.

Solder paste should be allowed to reach ambient working temperature prior to use. Generally, the paste should be removed from refrigeration at least 2 hours before use. The actual time to reach thermal equilibrium will vary with container size. Paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening.

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

• Discrete components - A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction
• Fine-pitch components - A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
• For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry-standard aperture and aspect ratios should be adhered to.

Cleaning

Indium8.9HFA is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover.

Automated stencil cleaning is best performed using a dry wipe followed by a vacuum wipe. If using a wet wipe, isopropyl alcohol or a solvent-based commercially available cleaner should be used. IPA and other solvent-based cleaners are also acceptable for manual stencil cleaning.