Indium 8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium 8.9 offers excellent stencil print transfer efficiency to work in the broadest range of processes. In addition, the superior soldering performance under high temperature and long reflow processes provides exceptional head-in-pillow performance.