• 230-RC core, SN995 alloy
• 0.020 diameter, 1LB spool
• Meets the requirement of J-STD-004B Type REL1
• The low-spatter formation gives you cleaner boards and increased operator safety with less than 1% spattering
• Light-coloured residue

Indium Corporation’s CORE 230-RC is a formula developed to meet the demanding requirements of robotic and laser soldering. It incorporates a highly effective activator package with new “no-spatter” technology in high-reliability flux media. CORE 230-RC is fully REACH-compliant, containing no REACH substance of very high concern (SVHCs). CORE 230-RC is not used solely for robotic and laser soldering since it also performs exceptionally well in hand soldering applications. The no-spatter feature eliminates flux spatters that can burn operators’ hands.

Process Recommendations:

• Match the tip size to the part to be soldered
• Apply the solder wire to the joint, not to the soldering iron tip
• Use the lowest temperature possible
• 610–700°F (320–370°C) for SnPb and Pb-free
• Surface mount (SMT) soldering should be completed in 1–2 seconds
• Plated through-hole (PTH) soldering should be completed in 1–3 seconds
• The robotic soldering process set-up is highly customizable and depends on the assembly being soldered
• A smooth solder joint appearance requires the correct amount of temperature and time; fine-tuning the process parameters may be required to achieve the best possible outcome
• During robotic soldering, flux build-up and charring may occur; to avoid build-up, increase the iron tip cleaning frequency or reduce the iron tip temperature

Indium Corporation specializes in making fine-diameter wire, typically between 0.008" (0.2mm) and 0.015" (0.381mm) diameter for robotic and laser soldering. To make robotic and laser soldering most effective and eliminate peaking and bridging, it is easiest to use an active flux such as CORE 230-RC at 4.0–4.5% flux by weight.