Henkel 144828 Chipbonder Snap Cure, Capillary Flow Epoxy Underfill, 10 mL Syringe
The Henkel 144828-V73 is a Series 3563 epoxy adhesive.
Note: This item is hazardous and may be subject to an additional handling fee.
Specifications
- Brand: Henkel
- Series: 3563
- Product Type: Epoxy Adhesive
- Hardness: 88Shore D
- Color: White
- Primary Color: White
- Physical Form: Liquid
- Gel Time: 12h
- Viscosity Measurement: 5000 to 12000mPa/s
- Shelf Life: 365 Days From Date of Manufacture
- Chemical Composition: Epoxy Resin, Silica, Epoxy Resin Modifier, 2-Propyl-1h-Imidazole, Imidazole
- Specific Gravity: 1.52
- VOCs Content: 8.27g/L
- Odor: Odorless
- Cure Type: Heat Cure
- Container Capacity: 10ml
- Container Type: Syringe
- Applications: Underfill for Flip Chip Devices
- Cure Time: >5min
- Dielectric Strength: 33.5kV/mm
- Elongation at Break: 3%
- Storage Conditions: -104F
- Weight: 0.629
- Country Of Origin: US