LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.

The Henkel 1188896 Specifications:

• Series: 933-1
• Product Type: Epoxy Resin
• Hardness: 92Shore D
• Color: Black
• Primary Color: Black
• Physical Form: Liquid/Paste
• Cure Time: 2h
• Viscosity Measurement: 360500mPa/s
• Shelf Life: 365days
• Chemical Composition: Aluminum Oxide, Fibrous, Limestone, Epoxy Resin, Epoxy Resin Modifier, P-Tert-Butylphenyl 1-(2,3-Epoxy)Propyl Ether, Quartz (SiO2), Carbon Black
• Specific Gravity: 2
• VOCs Content: <3%
• Odor: Slight
• Cure Type: Heat Cure
• Dielectric Strength: 1000V/mil
• Container Capacity: 22.5g
• Container Type: Syringe
• Applications: Encapsulating Microelectronic Chips