Henkel 1188896 - TRA-BOND 933-1 Epoxy, Black, 22.5g Syringe
LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
The Henkel 1188896 Specifications:
- Series: 933-1
- Product Type: Epoxy Resin
- Hardness: 92Shore D
- Color: Black
- Primary Color: Black
- Physical Form: Liquid/Paste
- Cure Time: 2h
- Viscosity Measurement: 360500mPa/s
- Shelf Life: 365days
- Chemical Composition: Aluminum Oxide, Fibrous, Limestone, Epoxy Resin, Epoxy Resin Modifier, P-Tert-Butylphenyl 1-(2,3-Epoxy)Propyl Ether, Quartz (SiO2), Carbon Black
- Specific Gravity: 2
- VOCs Content: <3%
- Odor: Slight
- Cure Type: Heat Cure
- Dielectric Strength: 1000V/mil
- Container Capacity: 22.5g
- Container Type: Syringe
- Applications: Encapsulating Microelectronic Chips