Hakko T30-J - T30 Series Soldering Tip; Bent Conical, R 0.2mm / 40° angle x 3mm

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Hakka-T-30J bent tip

5.0

Perfect tip to partner up with the T-30I straight tip while doing IPhone logic board repair.A little hot air preheat of board after BGA chip removed and fresh layer of flux put over the pads,add small amount of fresh lead solder to either tip and glide over the pads to remove original solder and tin them with leaded solder at same time.Use this method on the small tight locations where solder braid is very tight to adjacent components.The pads will be of equal height and just align new or Reballed chip carefully and the chip will self align with hot air.Robust tips average a year of heavy use.

ScroTecH on Oct 04, 2020 I found this helpful (0)