The differences in Chip Quik Sn42/Bi57.6/Ag0.4 solder paste are as follows: • Packaging - syringe, jar and cartridge • Flux type - no clean, water washable • Particle size - T3, T4 and T5 • Formula - regular, thermally stable The following is an overview of part numbers for Chip Quik Sn42/Bi57.6/Ag0.4 solder paste: Syringe • SMDLTLFP - no clean, 5cc syringe, 15g, T3 • SMDLTLFP10 - no clean, 10cc syringe, 35g, T3 • SMDLTLFP10T4 - no clean, 10cc syringe, 35g, T4 • SMDLTLFP10T5 - no clean, 10cc syringe, 35g, T5 • TS391LT - thermally stable, no clean, 5cc syringe, 15g, T4 • TS391LT10 - thermally stable, no clean, 10cc syringe, 35g, T4 Jar • SMDLTLFP15T4 - 15g, two part mix, T4 • SMDLTLFP60T4 - 60g, two part mix, T4 • SMDLTLFP50T3 - 50g, no clean, T3, 90% metal • SMDLTLFP250T3 - 250g, no clean, T3, 90% metal • SMDLTLFP250T4 - 250g, no clean, T4, 90% metal • SMDLTLFP250T5 - 250g, no clean, T5, 89.5% metal • TS391LT50 - 50g, thermally stable, no clean, T4, 90% metal • TS391LT250 - 250g, thermally stable, no clean, T4, 90% metal Cartridge • SMDLTLFP500T3C - 500g, no clean, T3, 87% metal • SMDLTLFP500T4C - 500g, no clean, T4, 87% metal • SMDLTLFP500T5C - 500g, no clean, T5, 86% metal • TS391LT500C - 500g, no clean, T4, 87% metal

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