Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (5cc/10g syringe)
Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 5cc syringe 10g w/plunger & tip.
Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum.
- Alloy: Sn96.5/Ag3.5
- Flux Type: Synthetic Water-Soluble
- Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA)
- Metal Content: 75% metal by weight
- Particle Size: T3 (25-45 microns)
- Melting Point: 221°C (430°F)
- Size: 5cc/10g syringe
Shelf Life
- Refrigerated >12 months, unrefrigerated >6 months
Stencil Life
- >12 hours @ 20-50% RH 22-28°C (72-82°F)
- >4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F) before use.