Solder Paste in jar 500g (T3)
Chip Quik® solder paste is manufactured using Made in USA high-quality synthetic flux and precision atomized metal powder. Chip Quik® solder paste is guaranteed for 12 months from the date of manufacture, regardless of refrigeration. If you have any issues with our solder paste, please contact Chip Quik® directly for a charge warranty replacement. Please retain the original bill of sale, and solder paste in the original container as we may request its return for internal R&D testing purposes.
Printer Operation
- Print Speed: 25-100mm/sec
- Squeegee Pressure: 70-250g/cm of blade
- Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
- >8 hours @ 20-50% RH 22-28°C (72-82°F)
- >4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F) before use.
Transportation
- This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life.