Solder Paste, No Clean, LF, T4, 88.5%, SAC306, 600g Cartridge, 38 Micron Series
Developed in combination with T4 and finer mesh lead-free alloy powders, M8 paste provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduces voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high-purity residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.