The revolutionary activator system in AIM's NC273LT low-temperature solder paste improves the wetting performance of bismuth alloys to RoHS-compliant plating and surface finishes. NC273LT provides long stencil life, excellent transfer efficiencies, and minimizes solder balling common to high bismuth alloys. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS-compliant replacement. Bismuth bearing solder pastes reduce peak reflow temperature requirements to as low as 170°C-185°C (338°F-365°F). As with any bismuth-containing alloy, the assembly must be completely lead-free.