• For Use with Demanding High-Density Electronic Assemblies
• Reduced Head-in-Pillow
• Extremely Stable Formula
• Extended Pause-to-Print Process Window
• Reduces Voiding on QFN Ground Pads

The NC520 is designed for the most demanding high-density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing, and reduced voiding. The superior wetting ability of NC520 results in bright, smooth, and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.