Surface Mount Chip Bond Epoxy for Dispensing Applications, 30cc Syringe
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4089 are adequate for use with high speed placement equipment.