AIM’s REL61TM is comprised of tin, bismuth, silver, copper micro-element grain structure refiners. REL61 provides the electronics assembly marketplace a low-cost alternative to SAC alloys that has reliability and performance characteristics equal to SAC305 and greater than other low/no-silver solder alloys. REL61 has shown to reduce tin whisker formation as well as out performing low/no-silver alloys in thermal shock, vibration and drop shock resistance. Lower reflow and solder pot temperature can be used with REL61 versus other low/no silver alloys.

CX18 is a no-clean flux core wire solder designed to offer excellent soldering results with all alloys and on all surface finishes. Engineered for high operator satisfaction CX18 is a low odor/smoke formula that promotes thermal transfer, and fast wetting without the need for additional flux. CX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements.

• Fast Wetting
• Minimal/Clear Residue
• Extends Solder Tip Life
• ROL0 per IPC J-STD-004
• REACH and RoHS Compliant
• Low Odor / Fumes